Sputteranlage UNIVEX 500/English: Difference between revisions
From IMT-Wiki
Jump to navigationJump to search
No edit summary |
No edit summary |
||
| Line 35: | Line 35: | ||
== Instructed Users == |
== Instructed Users == |
||
* [[ |
* [[User:Birgit.Huebner | Hübner, Birgit]] |
||
* [[ |
* [[User:Uwe.Koehler | Köhler, Uwe]] |
||
Latest revision as of 19:51, 19 November 2016
Device name: machine for sputtering - UNIVEX 500
Operator/Responsible for this device: Birgit Hübner, Uwe Köhler
Position: building 309, room 137
Device designation: SA 0818
Specifiaction number:
Short Description
The Leybold UNIVEX Z500 is able to sputter carbon coatings on silicon oxide wafers for x-ray masks.
Device Specifications
The process gas is argon.
Nitrogen is used to ventilate the vacuum chamber.
Established Processes
- 4" - silicon substrate (with 1% silicon oxide) can be coated with approximately 50 nm carbon (C).
- Glass slides also can be coated with approximately 100nm carbon (C).