Sputteranlage UNIVEX 500/English: Difference between revisions

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[[Datei:Reinraum_Sicherheit_001.jpg|250px|thumb|right|< machine for sputtering>]]
[[Datei:Sputteranlage_001_(Small).jpg|250px|thumb|right|<machine for sputtering>]]


[[Datei:Innenraum_Sputteranlage.jpg|250px|thumb|right|<machine for sputtering>]]


'''Device name:''' machine for sputtering - UNIVEX 500
'''Device name:''' machine for sputtering - UNIVEX 500


'''Operator/Responsible for this device:''' Birgit Hübner
'''Operator/Responsible for this device:''' Birgit Hübner, Uwe Köhler


'''Position:''' building 309, room 137
'''Position:''' building 309, room 137

Revision as of 13:13, 4 November 2013


250px|thumb|right|<machine for sputtering>

250px|thumb|right|<machine for sputtering>

Device name: machine for sputtering - UNIVEX 500

Operator/Responsible for this device: Birgit Hübner, Uwe Köhler

Position: building 309, room 137

Device designation: SA 0818

Specifiaction number:

Short Description

The Leybold UNIVEX Z500 is able to sputter carbon coatings on silicon oxide wafers for x-ray masks.

Alternatives

Device Specifications

The process gas is argon.

Nitrogen is used to ventilate the vacuum chamber.

Established Processes

  • 4" - silicon substrate (with 1% silicon oxide) can be coated with approximately 50 nm carbon (C).
  • Glass slides also can be coated with approximately 100nm carbon (C).



Restrictions

Instructed Users