Sputteranlage UNIVEX 500/English: Difference between revisions
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[[Datei:Sputteranlage_001_(Small).jpg|250px|thumb|right|<machine for sputtering>]] |
[[Datei:Sputteranlage_001_(Small).jpg|250px|thumb|right|<machine for sputtering>]] |
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The Leybold UNIVEX Z500 is able to sputter carbon coatings on silicon oxide wafers for x-ray masks. |
The Leybold UNIVEX Z500 is able to sputter carbon coatings on silicon oxide wafers for x-ray masks. |
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== Alternatives == |
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== Device Specifications == |
== Device Specifications == |
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== Established Processes == |
== Established Processes == |
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* 4" - silicon substrate (with 1% silicon oxide) can be coated with approximately 50 nm carbon (C). |
* 4" - silicon substrate (with 1% silicon oxide) can be coated with approximately 50 nm carbon (C). |
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== Restrictions == |
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Revision as of 12:37, 5 November 2013
250px|thumb|right|<machine for sputtering>
250px|thumb|right|<machine for sputtering>
Device name: machine for sputtering - UNIVEX 500
Operator/Responsible for this device: Birgit Hübner, Uwe Köhler
Position: building 309, room 137
Device designation: SA 0818
Specifiaction number:
Short Description
The Leybold UNIVEX Z500 is able to sputter carbon coatings on silicon oxide wafers for x-ray masks.
Device Specifications
The process gas is argon.
Nitrogen is used to ventilate the vacuum chamber.
Established Processes
- 4" - silicon substrate (with 1% silicon oxide) can be coated with approximately 50 nm carbon (C).
- Glass slides also can be coated with approximately 100nm carbon (C).
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