Sputteranlage UNIVEX 500/English: Difference between revisions
From IMT-Wiki
Jump to navigationJump to search
mNo edit summary |
No edit summary |
||
| Line 1: | Line 1: | ||
[[ |
[[file:Sputteranlage_001_(Small).jpg|250px|thumb|right|<machine for sputtering>]] |
||
[[ |
[[file:Innenraum_Sputteranlage.jpg|250px|thumb|right|<machine for sputtering>]] |
||
'''Device name:''' machine for sputtering - UNIVEX 500 |
'''Device name:''' machine for sputtering - UNIVEX 500 |
||
Revision as of 18:11, 19 November 2016
Device name: machine for sputtering - UNIVEX 500
Operator/Responsible for this device: Birgit Hübner, Uwe Köhler
Position: building 309, room 137
Device designation: SA 0818
Specifiaction number:
Short Description
The Leybold UNIVEX Z500 is able to sputter carbon coatings on silicon oxide wafers for x-ray masks.
Device Specifications
The process gas is argon.
Nitrogen is used to ventilate the vacuum chamber.
Established Processes
- 4" - silicon substrate (with 1% silicon oxide) can be coated with approximately 50 nm carbon (C).
- Glass slides also can be coated with approximately 100nm carbon (C).