F&E3/English
Department FuE3: Replication
Head of department: PD Dr. Matthias Worgull
The aim of our research activities is the replication of micro and nanostructures. Work is performed in the two topics
- Nano- and Microreplication
and
- Microthermoforming
The activities in research and development are focused on the following replication processes:
- Micro Hot Embossing
- Nanoimprint
- Microthermoforming
- Ultrasonic Embossing
We are partly integrated in European research projects like COTECH (Converging Technologies) with the aim to develop efficient replication techniques.
Our technology is also available for external user within the frame of the KNMF (Karlsruher Nano Micro Facility) and EUMINAfab.
Current Team
- PD Dr. Matthias Worgull (Head of department)
- Heinz Dinglreiter (Groupleader Microthermoforming)
- Marc Schneider (Installation- and Processmanager)
- Alexander Kolew (Post-Doc)
- Norbert Schneider (PhD-Student)
- Michael Hartmann
- Julia Bur (Diploma student)
- Raschid Ezzat (Diploma student)
- Christoph Herrmann (HiWi)
- Ludmilla Popp (HiWi)
- Gerlinde Utsch (HiWi)
Nano- and Microreplication
We apply hot embossing and nanoimprint for the replication of micro and nanostructures. 5 hot embossing machines are available allowing the replication of structures on an area of max. 8 inch. The process of hot embossing is characterized by a high flexibility and a large diversity of process variations, like double sided positioned embossing or replication of through holes. The equipment of the hot embossing machines allows the fast replication of prototypes in different polymers up to replication of small series.
The diversity of suitable mold inserts corresponds to the lithographic structuring methods available at IMT, which are Deep X-Ray Lithography (LIGA), UV Lithography and Electron Beam Lithography. As an alternative to the lithographic processes mold inserts can also be fabricated by micromechanical machining like milling or also by laser machining. Already existing structures, like structures fabricated by etching processes can be copied into nickel mold inserts by electroplating.
An advantage of hot embossing is the fast change of the molding material by the use of different polymer films during each embossing cycle. The diversity of the used polymers comprises the group of thermoplastic polymers:
- Amorphous polymers like PS, PMMA, COC, PC, PSU
- Semicrystalline polymers like PP, POM, PET, LCP, PEEK
- Low-melting glass
- Metallic glass, amorphous metalls
- Feedstock for ceramic or metallic parts
- Metallic foils and duromers
