Reinraum - Cleanroom/english: Difference between revisions
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'''Clean Rooms at IMT''' |
'''Clean Rooms at IMT''' |
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The IMT possesses ca. 500 m² of class ISO 7 (DIN EN ISO 14644) clean rooms. These rooms are under the supervision of the [[ |
The IMT possesses ca. 500 m² of class ISO 7 (DIN EN ISO 14644) clean rooms. These rooms are under the supervision of the [[Core Technologies (CTE)]] Department, represented by the group leader microtechnologies, [[Benutzer:Uwe.Koehler|Uwe Köhler]]. Devices in the clean rooms include the Electron Beam lithography and UV lithography facilities such as Direct Laser Writing, an [[EVG_620_Double_Side_Mask_Aligner|EVG mask aligner]] and two [[Nanoscribe PhotonicProfessional|NANOSCRIBE]] devices, as well as the surrounding infrastructure like Spin-Coater, Developer and Plasma Etching facilities. |
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For any work in the clean room, the rules of working instruction AA505.xx apply [[Reinraumregeln|(see here also)]]. Employees with a general safety instruction may enter the clean room '''accompanied by or under the supervision of an employee with entrance permit''' and use the facilities therein or do other things like SEM inspections or easy measurement tasks. |
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Anyone planning extensive '''independent work''' in the clean room has to request permission from CTE using form FB516.xx. In this form you need to describe the planned work and give the corresponding project number, state the estimated weekly working time, and have it signed by your leader of department. Employees with up to 3 month at IMT, are normally not allowed, others need at least 4 weeks of practice under supervision. After this period, your KIT card can be coded to open the doors to the clean room. |
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Revision as of 10:39, 27 July 2015
Clean Rooms at IMT
The IMT possesses ca. 500 m² of class ISO 7 (DIN EN ISO 14644) clean rooms. These rooms are under the supervision of the Core Technologies (CTE) Department, represented by the group leader microtechnologies, Uwe Köhler. Devices in the clean rooms include the Electron Beam lithography and UV lithography facilities such as Direct Laser Writing, an EVG mask aligner and two NANOSCRIBE devices, as well as the surrounding infrastructure like Spin-Coater, Developer and Plasma Etching facilities.
For any work in the clean room, the rules of working instruction AA505.xx apply (see here also). Employees with a general safety instruction may enter the clean room accompanied by or under the supervision of an employee with entrance permit and use the facilities therein or do other things like SEM inspections or easy measurement tasks.
Anyone planning extensive independent work in the clean room has to request permission from CTE using form FB516.xx. In this form you need to describe the planned work and give the corresponding project number, state the estimated weekly working time, and have it signed by your leader of department. Employees with up to 3 month at IMT, are normally not allowed, others need at least 4 weeks of practice under supervision. After this period, your KIT card can be coded to open the doors to the clean room.
