User:Birgit.Huebner/English: Difference between revisions

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== Birgit Hübner ==
== Birgit Hübner ==
[[Datei:Huebner.jpg|rahmenlos|links|Text der Bild-Legende]]
[[file:Huebner.jpg|rahmenlos|links|Text der Bild-Legende]]


'''Department''': MF - Working Group Microfabrikation
'''Department''': Core Technologies (CTE)


'''Research Field''': resist laboratory, laboratory for etching, ChemA
'''Research Field''': resist laboratory, laboratory for etching, ChemA
Line 14: Line 14:
'''e-mail''': mailto:birgit.huebner2@kit.edu
'''e-mail''': mailto:birgit.huebner2@kit.edu


'''Substitute''': [[Benutzer:Julia.Wolf|Wolf, Julia]]
'''Substitute''':


== Job Description ==
== Job Description ==


I'm an employee of the microfabrication and the substitute of Mrs Julia Wolf in the field of developing.
I'm an employee in microfabrication and Mrs Julia Wolfs' substitute in the field of developing.


⚫
== Further Tasks at IMT ==

⚫
* ChemA - Administrator of the clean room area ([[Reinraum - Cleanroom|IMT-clean room]])

Anyone who wants to bring chemicals into the clean room has to contact me and to register their chemicals with the associated material safety data sheet.


== Expertise ==
== Expertise ==


I'm a chemical loboratory assistant.
I'm a chemical loboratory assistant.

Due to I'm having a part-time job, I'm only in the morning in the IMT.
Due to my part-time job, I'm only in the morning at IMT.

* glue on resist foils (with the three-axis-table-robot, the thickness of foils can be 100 µm to 3 mm)
* resist casting on Invar-mask blanks and 4" wafers
* casting of mould inserts
* sputtering of carbon layers
* freeze drying with cyclohexane
* oxidation
* wet-chemical developing of irradiated resists (per pro.)
* wet-chemical etching with KOH and hydrofluoric acid (HF)
* gluing of fibre glass in V-ditches on Si-wafers
* organisation of the resist laboratory
* management of the ChemA for the clean room area


=== Devices ===
=== Devices ===

* [[4TEC-Plasmaätzer]]
* [[ANKA LIGA 1]]
*[[Kleberoboter]]
* [[ANKA LIGA 2]]
*[[Sputteranlage UNIVEX 500]]
*[[Oxidationsanlage]]
* [[Hotplatebox (Horst)]]
⚫
*[[Laserbeschriftungsgerät]]
* [[Hotplate (OPTIhot SHT20)]]
*[[Oberflächenmessgerät TENCOR P 2]]
⚫
* [[Laserbeschriftungsgerät]]
*[[Nassprozessanlage]]
* [[RIE-Anlage, Plasmalab 80 Plus]]
*[[Ultraschallreinigungsgerät: Sonorex]]
* [[Rasterelektronenmikroskop JSM-6600]]
*[[Messmikroskop Metalloplan HL]]
* [[Spincoater Primus STT15]]
*[[Höhentaster MT 60M]]
*[[Analysenwaage AT 460]]
*[[Vakuumofen Vacutherm]]
*[[Vakuumofen VT 6060 P]]
*[[Vakuum-Trockenschrank WTB Binder]]
*[[Umluftofen UT 5050 EK-LAF]]
*[[Umluftofen UT 5050]]
*[[Zeit-Drucksteuergerät]]


=== Processes ===
=== Processes ===
* gluing of resists
*[http://www.x-ray-optics.de/index.php?option=com_content&view=article&id=84%3Aliga-process&catid=29%3Ax-ray-optics&lang=en Direct-LIGA]
* sputtering of carbon layers
* freeze drying
* oxidation
* wet-chemical etching
* wet-chemical developing


=== Software ===
=== Software ===
* JR Points (version 4.6 - Software for the robot of gluing)
*
* AnalySIS
*
* MS Office


=== Materials ===
=== Materials ===
⚫
* PMMA-foils
* [[mr-L/mr-X|mr-X]]
* Durimide
* [[Silizium/Silicon|Silizium]]
** [[4"-Wafer 525 µm]]
** [[4"-Wafer 200 µm]]
** [[4"-Wafer 100 µm]]
* [[Titan/Titanium|Titanium]]
⚫
** 50 µm foils
* [[Thermo-Klebefolien - Thermal Release Tape|Thermal Release Tape]]

⚫
== Further Tasks at IMT ==
⚫
* ChemA - Administrator of the cleanroom area

Latest revision as of 19:36, 19 November 2016

Birgit Hübner

Text der Bild-Legende

Department: Core Technologies (CTE)

Research Field: resist laboratory, laboratory for etching, ChemA

Bau: 310

Raum: 252

Telephone: 0721/608-22601

e-mail: mailto:birgit.huebner2@kit.edu

Substitute:

Job Description

I'm an employee in microfabrication and Mrs Julia Wolfs' substitute in the field of developing.

Further Tasks at IMT

Anyone who wants to bring chemicals into the clean room has to contact me and to register their chemicals with the associated material safety data sheet.

Expertise

I'm a chemical loboratory assistant.

Due to my part-time job, I'm only in the morning at IMT.

  • glue on resist foils (with the three-axis-table-robot, the thickness of foils can be 100 µm to 3 mm)
  • resist casting on Invar-mask blanks and 4" wafers
  • casting of mould inserts
  • sputtering of carbon layers
  • freeze drying with cyclohexane
  • oxidation
  • wet-chemical developing of irradiated resists (per pro.)
  • wet-chemical etching with KOH and hydrofluoric acid (HF)
  • gluing of fibre glass in V-ditches on Si-wafers
  • organisation of the resist laboratory
  • management of the ChemA for the clean room area

Devices

Processes

  • gluing of resists
  • sputtering of carbon layers
  • freeze drying
  • oxidation
  • wet-chemical etching
  • wet-chemical developing

Software

  • JR Points (version 4.6 - Software for the robot of gluing)
  • AnalySIS
  • MS Office

Materials

  • PMMA-foils
  • Durimide
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