Teratronic Signal Processing (TSP)

Dr. Huanfa Peng [Contact]

Welcome

The Teratronic Signal Processing (TSP) group specializes in pushing the bandwidth limitations of on-chip signal processing into the THz regime by merging advanced electronics, photonics, and digital signal processing technologies. The group develops novel on-chip photonic devices, advanced photonic/RF packaging, and investigates novel signal processing concepts for synthesizing and analyzing ultra-broadband electromagnetic waveforms.

Wireless terahertz links can provide high-speed internet access to a dense mesh of small radio cells. Broadband optoelectronic signal processing shows tremendous potential in terahertz link applications.

Subject areas

Generation, detection, and processing of electromagnetic waveform is one of the most crucial technical foundations of modern society. Novel applications demand ultra-wide bandwidth and higher carrier frequency electromagnetic waveforms, which are difficult to process with state-of-the-art electronic devices. In the Teratronic Signal Processing (TSP) group, we merge advanced electronics, photonics, and digital signal processing technologies to enable ultrafast processing of electromagnetic waveforms at terahertz frequencies (0.1 – 10 THz). We explore novel on-chip photonic devices such as narrow-linewidth lasers, optical frequency comb devices, broadband electro-optic modulators, and waveguide-based optical amplifiers. Moreover, we examine novel signal processing concepts and systems where we combine massively parallel processing in digital electronic circuits with synthesis and analysis of broadband waveforms in the optical domain. We also focus on the integration and miniaturization of these systems on a chip level by exploiting multi-chip photonic assembly and advanced RF packaging techniques. The viability of the devices and concepts is also experimentally demonstrated in applications of high relevance, such as high-speed communications, metrology, and sensing.